Centerline Technologies, LLC
577 Main Street, Suite 270, Hudson, MA 01749
Centerline Technologies provides ultra-precision services for grinding, lapping, polishing, diamond sawing and laser machining of metals, ceramic, sapphire and other materials — for the telecommunication, semiconductor, communication, test & measurement, micro-electronic, defense and security industries.
More Business Info
Start with the right materials, process with precision, and finished for success.
- BBB Rating
- Hours
- Regular Hours
Mon - Fri: Sat - Sun Closed - Extra Phones
Fax: 978-568-1334
- Services/Products
- Materials Inventory/Management
- Laser Machining
- CMP
- Polishing
- Via Planarity Processing
- Back Grinding
- Laser Scribing
- Wafer Dicing
- Lapping
- Laser Drilling
- Edge Grinding
- Surface Grinding
- Substrate Engineering
- Aluminum Nitride (AlN) 170 W/mK, 200 W/mK, 230 W/mK
- Beryllium Oxide (BeO) 99.5% purity. 285 W/mK or 325 W/mK
- Quartz
- Fused Silica (SiO2)
- Zirconia
- Alumina (Al2O3) Ceramic Substrates 90%, 96%, 99.5%, 99.6%, 99.8%
- Ferrite
- Sapphire
- Specialty Metals
- Specialty Glass
- Silicon Carbide
- Silicon Nitride (Si3N4) 90 W/mK
- Tungsten Carbide
- Brands
- CoorsTek, Toshiba, Materion, Dynasil, Rubicon, Gavish, Maruwa, CeramTec
- Payment method
- discover, visa, check, invoicing available, mastercard, cash
- Amenities
- Centerline's inventory of substrate materials, (Al203, AlN, BeO, SiO2, Si3N4, Sapphire, Glass, etc.), from the industries best manufactures, enables us to offer lead times that meet your demands.
- Accreditation
ISO 9001:2015 Customer Focus, Technical Excellence, and Continual Improvement
ITAR Compliant
- Associations
- iMAPS (International Microelectronics and Packaging Society),SPIE (The international society for optics and photonics),ASM International,ACerS (The American Ceramic Society)
- AKA
Centerline Technologies
- Other Links
- Categories
- Contract Manufacturing, Industrial Ceramic Products, Laser Cutting, Machine Shops, Polishes, Solid Surface Materials
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